JPS6314475Y2 - - Google Patents

Info

Publication number
JPS6314475Y2
JPS6314475Y2 JP1982007094U JP709482U JPS6314475Y2 JP S6314475 Y2 JPS6314475 Y2 JP S6314475Y2 JP 1982007094 U JP1982007094 U JP 1982007094U JP 709482 U JP709482 U JP 709482U JP S6314475 Y2 JPS6314475 Y2 JP S6314475Y2
Authority
JP
Japan
Prior art keywords
guide hole
substrate
resin
conductor pattern
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982007094U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58111967U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP709482U priority Critical patent/JPS58111967U/ja
Publication of JPS58111967U publication Critical patent/JPS58111967U/ja
Application granted granted Critical
Publication of JPS6314475Y2 publication Critical patent/JPS6314475Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP709482U 1982-01-22 1982-01-22 高密度回路基板構造 Granted JPS58111967U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP709482U JPS58111967U (ja) 1982-01-22 1982-01-22 高密度回路基板構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP709482U JPS58111967U (ja) 1982-01-22 1982-01-22 高密度回路基板構造

Publications (2)

Publication Number Publication Date
JPS58111967U JPS58111967U (ja) 1983-07-30
JPS6314475Y2 true JPS6314475Y2 (en]) 1988-04-22

Family

ID=30019858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP709482U Granted JPS58111967U (ja) 1982-01-22 1982-01-22 高密度回路基板構造

Country Status (1)

Country Link
JP (1) JPS58111967U (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104568U (en]) * 1980-12-18 1982-06-28

Also Published As

Publication number Publication date
JPS58111967U (ja) 1983-07-30

Similar Documents

Publication Publication Date Title
KR101015651B1 (ko) 칩 내장 인쇄회로기판 및 그 제조방법
JPS6314475Y2 (en])
JPH0220861Y2 (en])
JPS5930555Y2 (ja) プリント基板
TWI850661B (zh) 封裝結構及其製備方法
JPH08340164A (ja) Ｂｇａ型パッケージの面実装構造
JPH0747901Y2 (ja) 印刷配線板
JPS6239089A (ja) 回路基板
JPS5826544Y2 (ja) フレキシブル印刷配線板
JP3174957B2 (ja) 電子回路モジュール用基板、およびこれを用いた電子回路モジュール
JP3269506B2 (ja) 半導体装置
JPH0217501Y2 (en])
JPS5923432Y2 (ja) 半導体装置
JP2715957B2 (ja) 混成集積回路装置
JPH03225992A (ja) 面付け部品搭載プリント基板及びその製造方法
JPH0642364Y2 (ja) 回路ブロツクの構造
JPH0648876Y2 (ja) 半導体装置
JPH0735404Y2 (ja) 半導体装置
JPS60227492A (ja) 電子回路ブロツク
JPS5920671U (ja) プリント配線板
JPH0817861A (ja) Ｔａｂテープを用いたチップ型電子部品
JPS5848496A (ja) 小型電子回路部品構体
JPS5914394U (ja) 混成集積回路基板
JPS60170944A (ja) 半導体装置と基板の取付方法
JPS5952485U (ja) 半導体試験用基板